Episode 9: BNY Mellon's Meredith Oakes on Building a Talent Pipeline

For many organizations, the extent of their campus outreach is a few college recruiting fairs and a summer internship program. That’s a big miss in a competitive economy where talent is the currency. Either due to a lack of vision or a short-sighted strategy, organizations simply don’t think long and hard enough about how to build a robust pipeline that delivers talented people from schools into the workplace. When Meredith Oakes took over BNY Mellon’s talent pipeline development in 2017, she set out to change that dynamic. That began with looking beyond the stereotypes to understand what early career professionals actually want from work and turning that into programs that deliver long-term value for them as well as the 200-plus year old Wall Street stalwart. In this podcast recorded live at the City Winery in New York City, Meredith shares why BNY Mellon made pipeline development a strategic priority and what other learning executives can learn from their programs about how to build long-term relationships with early career professionals. Plus, co-host and resident CLO Breakfast Club health expert Justin Lombardo offers his tips for navigating flu season and how working with schools and universities is exactly the type of work at which chief learning officers can excel. Thank you to our episode sponsors: This episode of the CLO Breakfast Club Podcast is brought to by O’Reilly Media. O’Reilly’s online learning platform can help your employees learn on the job, get quick answers on the fly and advance your organization’s goals. Learn more at oreilly.com.   This episode is also brought to you by BetterUp and DeVryWORKS. Help your organization cultivate a coaching culture with BetterUp, the industry’s first mobile platform that provides personalized coaching at scale. Learn more by visiting betterup.co. DeVryWORKS can help with workforce solutions to attract, aquire and develop the leaders of tomorrow in your organization. Learn more at devryworks.com.

2356 232